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Semiconductor Factory Automation:

Technology Issues and Market Forecasts

 

 

TABLE OF CONTENTS

 

Chapter 1

Introduction 

1-1

 

 

 

Chapter 2 

Executive Summary

2-1

 

 

 

2.1

Summary of Major Issues

2-1

2.2 

Summary of Market Forecasts

2-3

 

 

 

Chapter 3 

Driving Forces

3-1

 

 

 

3.1 

Introduction

3-1

3.2 

Trend to 300 mm Wafers

3-2

3.3 

Development Costs

3-4

3.4

Single-Wafer Processing

3-5

3.5

Trends in Processing Tools

3-6

3.6

Automation Trends

3-8

3.7

Benefits of Automated Wafer Handling

3-14

 

 

 

Chapter 4

Software

4-1

 

 

 

4.1

Introduction

4-1

4.2

The Evolution of CIM

4-2

4.3

MES in Industry

4-5

4.3.1

MES Functionalities

4-13

4.3.2

MES Products

4-16

4.4

Communication Standards

4-33

4.5

Sematech CIM Framework

4-44

 

 

 

Chapter 5

Hardware

5-1

 

 

 

5.1

Introduction

5-1

5.2

Elements of Automation

5-2

5.2.1

Tool Automation

5-2

5.2.2

Intrabay Automation

5-3

5.2.3

Interbay Automation

5-4

5.2.4

Material-Control System

5-7

5.3

Flexible Automation

5-9

5.4

Reliability

5-11

5.5

Tool Issues and Trends

5-12

5.5.1

Flexible Tool Interface

5-12

5.5.2

Vacuum Robotics

5-31

5.5.3

AGV

5-41

5.5.4

CMP

5-44

5.5.5

300-mm Wafer Transport

5-45

5.5.6

Bridge Tools

5-48

5.5.7

Mini-Environments and Cleanroom Issues

5-51

 

 

 

Chapter 6

Market Analysis

6-1

 

 

 

6.1

Driving Forecast

6-1

6.2

Market Forecast Assumptions

6-11

6.3

Market Forecast

6-12

6.3.1

Automated Transfer Tool Market

6-12

6.3.2

Carrier Transport Market

6-20

6.3.3

MES Software Market

6-29

 

 

 

Chapter 7 

User Issues

7-1

 

 

 

7.1

Current Automation Thinking

7-1

7.2

The New Factory Paradigm

7-2

7.3

The New Factory in Action

7-3

7.4

Return on Investment Considerations

7-3

7.5

Eight Symptoms of the Old Paradigm

7-5

7.6

Putting the New Paradigm to Work

7-6

 

 

 

 

LIST OF FIGURES

 

 

 

 

1.1

Advanced CIM System

1-3

3.1

Automated Materials Handling System (AMHS) Framework

3-12

4.1

Evolution of CIM

4-3

4.2

Computer Integrated Fab Environment

4-7

4.3

Message Integration in CIM

4-8

4.4

Host Equipment Communications Standards

4-29

4.5

Sematech CIM Framework Scope

4-45

5.1

Material-Control System

5-8

5.2

Traditional and Flexible Automated Material Handling System

5-10

5.3

Overhead Monorail Delivery - Cassette in Box, Cassette in SMIF Pod

5-16

5.4

Stocker Design and Interfaces

5-54

6.1

Semiconductor Equipment Utilization

6-4

6.2

Revenue Losses from Wafer Defects

6-5

6.3

Market Shares of Automated Wafer Transfer Suppliers

6-18

6.4

Worldwide Market Shares of Carrier Transport Suppliers

6-25

6.5

Worldwide Market of Shares MES Software Suppliers

6-33

 

 

 

 

LIST OF TABLES

 

 

 

 

6.1

Three-Year Savings for Automation

6-7

6.2

Cost of Alternative Automated Systems

6-8

6.3

Three-year Costs for Alternative Automated Systems

6-10

6.4

Worldwide Forecast of Automated Transfer Tools

6-14

6.5

Worldwide Market Shares of Transfer Tool Suppliers

6-16

6.6

Process Tool Automation For 300mm Fabs

6-19

6.7

Worldwide Forecast of Carrier Transport Market

6-22

6.8

Worldwide Market Shares of Carrier Transport

6-24

6.9

Worldwide Forecast of MES Software

6-32