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Markets and Strategies for Chemical and Material Suppliers in Niche Markets

 

 

TABLE OF CONTENTS

 

Chapter 1

Introduction

1-1

 

 

 

Chapter 2

Solar

2-1

2.1

Introduction

2-1

2.2

Crystalline and Polycrystalline Cell Manufacturing

2-4

2.2.1

Silicon Growing and Wafering

2-4

2.2.2

Etching and Texturig

2-7

2.2.3

Anti-Reflection Coatings

2-8

2.3

Thin Film Cell Manufacturing

2-8

2.3.1

Amorphous Silicon Deposition

2-8

2.3.2

Microcrystalline Silicon Deposition

2-10

2.3.3

CdTe Cadmium Telluride Deposition

2-11

2.3.4

CIGS - Copper Indium Gallium Selenide Deposition

2-14

2.3.5

GaAs Gallium Arsenide

2-21

2.4

Markets for Materials Suppliers

2-24

2.4.1

Crystalline and Polycrystalline Cell Forecast

2-24

2.4.2

Thin Film Cell Forecast

2-28

2.4.3

Chemicals and Materials Forecast

2-33

2.5

Nanomaterials As Solar Conversion

2-43

2.5.1

Inorganic Nanocrystals

2-46

2.5.2

CdSe And CdTe Nanorods

2-50

2.5.3

Quantum Dots

2-52

2.5.4

Nanocomposite Quantum Dot Combination

2-53

2.5.5

Quantum Wells

2-54

2.5.6

Organic Polymers Fullerenes

2-55

2.5.7

Ionic Organic Polymers

2-57

2.5.8

CIGS

2-57

2.5.9

Dye-Sensitized Solar Cells

2-60

2.5.10

Analysis Of Nanomaterial Markets For Solar Cells

2-63

 

 

 

Chapter 3

MEMs

3-1

3.1

The MEMS Market Infrastructure

3-1

3.2

Forecast Of The Key Applications And Markets

3-3

3.2.1

MEMS Device Market Forecast

3-3

3.2.2

MEMS System Market Forecast

3-15

3.3.2

Markets for Materials Suppliers

3-18

 

 

 

Chapter 4

HB-LEDs

4-1

4.1

Recent Progress in High Brightness LED Technology and Applications

4-1

4.2

Materials of Construction

4-10

4.2.1

Phosphor

4-10

4.2.2

Substrate

4-16

4.3

OLED Manufacturing

4-24

4.4

Outlook for the Worldwide OLED Market

4-31

4.5

Outlook for the Worldwide HB-LED Market

4-35

 

 

 

Chapter 5

Thin Film Read/Write Heads for HDD

5-1

5.1

Trends in HDDs

5-1

5.2

Recording Head Market Forecast

5-9

5.3

Head Processing

5-12

5.4

Head Fabrication

5-17

5.5

Deposition Challenges

5-20

5.6

CMP Challenges

5-21

5.7

CMP Slurry Market

5-28

5.7.1

Ceria Slurry For Glass Disk Market

5-28

5.7.2

Oxide Slurry For Metal Disk Market

5-33

5.7.3

Oxide Slurry For Thin Film Head Market

5-36

 

 

 

Chapter 6

Wafer Level Processing (WLP)

6-1

6.1

Introduction

6-1

6.2

Flip Chip/WLP Processing Issues and Trends

6-2

6.2.1

Wafer Bumping

6-2

6.2.2

Wafer Level Packaging

6-6

6.2.3

Pad Redistribution

6-10

6.2.4

Wafer Bumping Costs

6-16

6.3

Metallization Issues and Trends

6-18

6.3.1

Gold Bumping Metallization

6-18

6.3.2

Solder Bumping Metallization

6-19

6.4

UBM Etch Issues And Trends

6-22

6.4.1

Etch Process

6-22

6.4.2

Etch Chemistry

6-24

6.5

Analysis of WLP Market

6-26

 

LIST OF FIGURES

 

2.1

Diagram Of Solar Cell

2-2

2.2

Cross Section Of A Solar Cell Under Illumination

2-3

2.3

Polysilicon Manufacturing And Supply Chain

2-6

2.4

Cross-Sectional Schematic Diagram Of The InGaP/InGaAs/Ge ATJ Cell

2-23

2.5

Percentage Gas Costs For Amorphous Silicon Solar Cell

2-42

3.1

MEMs Chemicals Forecast

3-20

3.2

MEMs Photomasks Forecast

3-23

3.3

MEMs Substrate Forecast

3-25

3.4

Forecast of MEMs Wafer Size

3-28

4.1

Operation of LED

4-2

4.2

Market drivers for LED Biz and Applications

4-6

4.3

SSL vs. Classical Technologies

4-7

4.4

LED Performance vs. Traditional Light Sources

4-8

4.5

Regular LED (white) Front-End Steps

4-12

4.6

Packaged LED Cost Basis

4-14

4.7

Packaged LED Cost Basis

4-15

4.8

Regular LED (White) Production Costs For 100k Wafers/Year

4-17

4.9

HB LED (White) Production Costs For 100k Wafers/Year

4-18

4.10

LED Cost Model: Impact Of Substrate Choice

4-19

4.11

Main Manufacturing Steps For GaN-Based Led

4-21

4.12

Schematic Of AMOLED

4-32

4-13

Active Matrix OLED Capacity And Demand Forecast

4-33

5.1

Hard Disk Drive Roadmap

5-2

5.2

Decrease In Average Price Of Storage

5-3

5.3

Heads Per Drive

5-5

5.4

Market Forecast Of Recording Head Consumption

5-10

5.5

Heads Per Drive Forecast

5-11

5.6

Thin Film Head Structure

5-13

5.7

Critical Features In Thin Film Head Structure

5-14

5.8

Spin Valve Head Structure

5-15

5.9

Cross-Sectional View TFH Stacks

5-18

5.10

Cross-Sectional View Of A TFH Design

5-19

5.11

CMP Slurry System For TFH Wafer Polishing

5-26

5-12

Total Slurry Consumption For HDD Forecast

5-38

6.1

Solder Bumping Process

6-4

6.2

Pillar-WLP CSP Process

6-11

6.3

Pad Redistribution Process

6-14

 

LIST OF TABLES

 

2.1

Historic Solar Cell Production By Region

2-25

2.2

Solar Cell Forecast

2-27

2.3

Market Share Of Solar Cells By Technology

2-29

2.4

Cost Comparison Of Thin Film Technologies

2-32

2.5

Polysilicon Production Capacities By Company

2-34

2.6

Affect Of Substrate Material On Cigs Solar Efficiency

2-37

2.7

Forecast Of Transparent Electrodes For Photovoltaics

2-39

2.8

Solar Materials Forecast Crystalline Silicon Cells

2-41

3.1

MEMS Device Market Forecast

3-4

3.2

MEMS System Markets Forecast

3-17

4.1

Color, Wavelength Material Of LED

4-3

4.2

Comparison of LED, HB-LED, UHB-LED Characteristics

4-9

4.3

Production Method for Various LEDs

4-11

4.4

Comparison Of $/Klm For LED Made On Various 2" Susbtrates

4-20

4.5

Forecast Of Sapphire Substrate Size Distribution By Area

4-22

4.6

Sapphire Substrate Market Forecast

4-23

4-7

Projected Costs Of OLED Lighting Panels (Sheet Processed) Stage

4-28

4-8

Projected Costs Of OLED Lighting Panels (Web Processed) Stage

4-29

4.9

Global LED Market Forecast

4-44

5.1

Slurry And Abrasive Suppliers And Products

5-30

5.2

Worldwide Ceria Slurry For Glass Media Market Forecast

5-32

5.3

Worldwide Oxide Slurry For Metal Market Forecast

5-35

5.4

Worldwide Oxide Slurry For Thin Film Heads Market Forecast

5-37

6.1

Common UBM Stacks For Solder And Gold Bumping

6-3

6.2

Solder Bumping Guidelines

6-5

6.3

ITRS Pin Counts For Different Applications

6-7

6.4

Pillar-WLP CSP Guidelines

6-12

6.5

Pad Redistribution Guidelines

6-15

6.6

Common UBM Stacks For Gold And Solder Bumping

6-19

6.7

UBM Film Etchants

6-25

6.8

WLP Demand By Device (Units)

6-27

6.9

WLP Demand By Device (Wafers)

6-28